Invention Grant
- Patent Title: Stackable near-field communications antennas
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Application No.: US15977178Application Date: 2018-05-11
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Publication No.: US11342108B2Publication Date: 2022-05-24
- Inventor: Bo Wen , Bing Dang , Rajeev Narayanan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H02J7/02 ; H02J50/10 ; H02J50/20 ; H01Q7/00 ; H01F41/04 ; H01F41/12 ; H04B5/00 ; H01F27/32

Abstract:
Techniques regarding one or more NFC antennas that can comprise vertically stacked coils of electrically conductive material are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise can a first substrate layer that can comprise a first coil of electrically conductive material that can be wound in a first direction. The apparatus can also comprise a second substrate layer that can comprise a second coil of electrically conductive material that can be wound in a second direction opposite the first direction. The first substrate layer can be stacked onto the second substrate layer. Also, the first coil of electrically conductive material can be operably coupled to the second coil of electrically conductive material through an interconnection via to form an NFC antenna.
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