Invention Grant
- Patent Title: Electronic device and manufacturing method thereof and manufacturing method of driver IC
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Application No.: US17001701Application Date: 2020-08-25
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Publication No.: US11342300B2Publication Date: 2022-05-24
- Inventor: Youhei Iwai , Hideaki Abe
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2019-156735 20190829
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L21/78 ; H01L21/304
Abstract:
The purpose of the invention is to counter measure a disconnection between the driver IC and the terminal when the terminal area of the electronic device is curved. One of the structures is as follows. An electronic device comprising: a driver IC installed in a terminal area, the terminal area being curved, wherein the driver IC has a circuit and plural bumps, the driver IC has a tapered portion formed on an opposite surface from a surface that the plural bumps are formed, the tapered portion overlaps with an outer most bump of the plural bumps.
Public/Granted literature
- US20210066238A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURING METHOD OF DRIVER IC Public/Granted day:2021-03-04
Information query
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