Invention Grant
- Patent Title: Integrated circuit layout, method, structure, and system
-
Application No.: US17025563Application Date: 2020-09-18
-
Publication No.: US11342341B2Publication Date: 2022-05-24
- Inventor: Meng-Sheng Chang , Chien-Ying Chen , Chia-En Huang , Yih Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/112
- IPC: H01L27/112 ; G06F30/392 ; H01L23/528 ; H01L23/522

Abstract:
A method of generating an IC layout diagram includes positioning a first active region between second and third active regions, intersecting the first active region with first through fourth gate regions to define gate locations of first and second anti-fuse bits, aligning first and second conductive regions between the first and second active regions, thereby intersecting the first conductive region with the first gate region and the second conductive region with the fourth gate region, and aligning third and fourth conductive regions between the first and third active regions, thereby either intersecting the third and fourth conductive regions with the first and third gate regions, or intersecting the third and fourth conductive regions with the second and fourth gate regions. At least one of positioning or intersecting the first active region, or aligning the first and second or third and fourth conductive regions is executed by a processor.
Public/Granted literature
- US20210202505A1 INTEGRATED CIRCUIT LAYOUT, METHOD, STRUCTURE, AND SYSTEM Public/Granted day:2021-07-01
Information query
IPC分类: