Invention Grant
- Patent Title: Camera module assembly including flexible circuit board maintained in bent state and electronic device including same
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Application No.: US16975047Application Date: 2019-02-20
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Publication No.: US11343416B2Publication Date: 2022-05-24
- Inventor: Myungjae Jo , Kwangmin Gil
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2018-0021629 20180223
- International Application: PCT/KR2019/002037 WO 20190220
- International Announcement: WO2019/164242 WO 20190829
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H05K1/02

Abstract:
Various embodiments related to a camera module assembly are presented and, according to one embodiment, the camera module assembly comprises: at least one camera module including a lens assembly, an image sensor configured to receive light having passed through the lens assembly, a camera housing for accommodating the lens assembly and the image sensor therein, a circuit board having the image sensor arranged thereon, and a flexible printed circuit board electrically connected with the circuit board and including wiring and a connector, which are for connecting the image sensor with an external device; and a support member including an opening for accommodating the at least one camera module in at least a part thereof, wherein the support member can be formed such that at least a part of the flexible printed circuit board is maintained in a bent state through at least a part of the opening, and additional other various embodiments are possible.
Public/Granted literature
Information query