- 专利标题: Stacked scalable voltage regulator module for platform area miniaturization
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申请号: US16988759申请日: 2020-08-10
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公开(公告)号: US11343906B2公开(公告)日: 2022-05-24
- 发明人: Tai Loong Wong , Fern Nee Tan , Tin Poay Chuah , Min Suet Lim , Siang Yeong Tan
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Viering, Jentschura & Partner MBB
- 优先权: MYPI2020002911 20200608
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/14
摘要:
The present disclosure generally relates to a scalable computer circuit board having a first power level semiconductor package coupled to at least one base-level voltage regulator module, which is coupled to a plurality of connection receptacles that are configured for connecting with a voltage regulator module positioned on a second level, as a standardized base unit. To scale the base unit, a second power level semiconductor package may be exchanged for the first power level semiconductor package in conjunction with one or more voltage regulator module board being positioned over a corresponding number of base-level voltage regulator modules and coupled to their plurality of connection receptacles.
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