Invention Grant
- Patent Title: High temperature tie layer compositions, and articles made therefrom
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Application No.: US17047782Application Date: 2019-04-18
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Publication No.: US11345800B2Publication Date: 2022-05-31
- Inventor: Dane Chang , Condell Doyle
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2019/028025 WO 20190418
- International Announcement: WO2019/204549 WO 20191024
- Main IPC: B32B1/08
- IPC: B32B1/08 ; B32B27/08 ; B32B27/12 ; B32B27/32 ; C08L23/08

Abstract:
A tie layer composition comprising from 60 wt. to 95 wt. % of a first polyethylene composition comprising a first molecular weight ethylene-based polymer component and a second molecular weight ethylene-based polymer component, wherein the polyethylene resin has a density from 0.940 to 0.960 g/cc and a melt index (I2) from 0.01 to 5 g/10 min; and from 5 wt. % to 40 wt. % of a second polyethylene composition comprising: (i) a high density polyethylene having a density greater than or equal to 0.940 g/cc; and (ii) a maleic-anhydride grafted polyethylene.
Public/Granted literature
- US20210155784A1 HIGH TEMPERATURE TIE LAYER COMPOSITIONS, AND ARTICLES MADE THEREFROM Public/Granted day:2021-05-27
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