Invention Grant
- Patent Title: Heat transfer augmentation feature
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Application No.: US16860481Application Date: 2020-04-28
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Publication No.: US11346244B2Publication Date: 2022-05-31
- Inventor: Gary D. Roberge
- Applicant: Raytheon Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: Raytheon Technologies Corporation
- Current Assignee: Raytheon Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: F01D25/10
- IPC: F01D25/10 ; F01D25/12 ; F02C7/18 ; F28F1/12

Abstract:
A thermal management system includes a heat exchanger defining a confined volume for thermal transfer between a first flow within a first passage and a second flow within a second passage. A first conduit outside the confined volume communicates the first flow to the first passage of the heat exchanger. A thermal transfer augmenter is attached to the first conduit.
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