Invention Grant
- Patent Title: Arranging three-dimensional models
-
Application No.: US17251989Application Date: 2019-03-27
-
Publication No.: US11348313B2Publication Date: 2022-05-31
- Inventor: Jordi Roca Vila , Sergio Gonzalez Martin , Quim Muntal Diaz
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Development
- International Application: PCT/US2019/024349 WO 20190327
- International Announcement: WO2020/197553 WO 20201001
- Main IPC: G06T17/20
- IPC: G06T17/20 ; B29C64/386 ; G06F30/23 ; B33Y50/02 ; G06T19/20

Abstract:
Examples of the present disclosure relate to a method for packing three dimensional (3D) models. The method comprises identifying a plurality of sections of each 3D model according to curvature profiles of the sections; associating a build material layer thickness to each section of the plurality of sections, whereby each associated build material layer thickness is one of a set of pre-established build material layer thicknesses; packing the plurality of 3D models according to each associated build material layer thickness, whereby packing comprises spatially arranging at least some 3D models in the 3D virtual build volume according to one or more criteria, such that at least some of the sections of different 3D models associated to a same build material layer thickness are arranged in a same region of the 3D virtual build volume.
Public/Granted literature
- US20220012944A1 ARRANGING THREE-DIMENSIONAL MODELS Public/Granted day:2022-01-13
Information query