Invention Grant
- Patent Title: Method and apparatus for splitting data in multi-connectivity
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Application No.: US16445813Application Date: 2019-06-19
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Publication No.: US11349739B2Publication Date: 2022-05-31
- Inventor: Hee-su Im , Byung-seung Kim , Eun-jun Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0123273 20181016
- Main IPC: H04L43/0864
- IPC: H04L43/0864 ; H04W24/08 ; H04W84/04 ; H04W88/06

Abstract:
A method for multi-connectivity between a plurality of base stations and user equipment includes estimating, at the user equipment, a first round trip time (RTT) taken in transmitting first data to a first base station, estimating, at the user equipment, a second RTT taken in transmitting second data to a second base station, and determining a size of the first data which is to be transmitted to the first base station, based on the first RTT and the second RTT.
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