Invention Grant
- Patent Title: Hinge module including detent structure and foldable electronic device including the hinge module
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Application No.: US16793758Application Date: 2020-02-18
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Publication No.: US11353932B2Publication Date: 2022-06-07
- Inventor: Jongyoon Kim , Jungjin Kim , Chungkeun Yoo , Jongmin Kang , Suman Lee , Hyunggeun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2019-0019560 20190219,KR10-2019-0062226 20190528
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02 ; E05D11/10 ; E05D7/00 ; H05K5/02 ; H05K5/00
Abstract:
A foldable electronic device includes a foldable housing including a hinge structure, a first housing structure, a second housing structure, and a hinge housing, a flexible display, and a first detent structure. The first detent structure includes a first member connected to the first housing structure, a second member connected with the second housing structure, a first ball and a second ball disposed in the first member, and an elastic member that is located in the first member between the first ball and the second ball and that presses the first ball and the second ball outward.
Public/Granted literature
- US20200267244A1 HINGE MODULE INCLUDING DETENT STRUCTURE AND FOLDABLE ELECTRONIC DEVICE INCLUDING THE HINGE MODULE Public/Granted day:2020-08-20
Information query
