Invention Grant
- Patent Title: Thermal profiles
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Application No.: US17044902Application Date: 2018-10-14
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Publication No.: US11353940B2Publication Date: 2022-06-07
- Inventor: Peter Seiler , Adolfo Gomez , Hoang Ngo
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Brooks, Cameron & Huebsch PLLC
- International Application: PCT/US2018/055788 WO 20181014
- International Announcement: WO2020/081042 WO 20200423
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
An example apparatus comprising a heat dissipation mechanism and a controller to detect a temperature of a surface of the apparatus, in response to detecting that an audio output device is connected to the apparatus, determine a thermal profile, and instruct the heat dissipation mechanism to dissipate heat from the apparatus based on the thermal profile.
Public/Granted literature
- US20210365089A1 THERMAL PROFILES Public/Granted day:2021-11-25
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