- 专利标题: Curable semiconducting composition
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申请号: US16466747申请日: 2017-12-14
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公开(公告)号: US11355261B2公开(公告)日: 2022-06-07
- 发明人: Yichi Zhang , Timothy J. Person , Shrikant Dhodapkar , Remi A. Trottier
- 申请人: Dow Global Technologies LLC
- 申请人地址: US MI Midland
- 专利权人: Dow Global Technologies LLC
- 当前专利权人: Dow Global Technologies LLC
- 当前专利权人地址: US MI Midland
- 国际申请: PCT/US2017/066247 WO 20171214
- 国际公布: WO2018/118603 WO 20180628
- 主分类号: H01B3/44
- IPC分类号: H01B3/44 ; C08L23/08 ; C09D5/24 ; C09D123/08 ; H01B1/20 ; H01B3/34 ; H01B3/46
摘要:
A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.
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