- 专利标题: Semiconductor device structure and method for forming the same
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申请号: US17028683申请日: 2020-09-22
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公开(公告)号: US11355605B2公开(公告)日: 2022-06-07
- 发明人: Tung-Ying Lee , Kai-Tai Chang
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L29/417
- IPC分类号: H01L29/417 ; H01L27/088 ; H01L21/8234 ; H01L29/423 ; H01L29/78 ; H01L29/06 ; H01L29/40 ; H01L29/66
摘要:
A method for forming a semiconductor device structure is provided. The method includes providing a substrate, a first nanostructure, and a second nanostructure. The method includes forming an isolation layer over the base. The method includes forming a gate dielectric layer over the first nanostructure, the second nanostructure, the fin, and the isolation layer. The method includes forming a gate electrode layer over the first part. The method includes forming a spacer layer. The method includes removing the second part of the gate dielectric layer and the first upper portion of the isolation layer to form a space between the fin and the spacer layer. The method includes forming a source/drain structure in the space and over the first nanostructure and the second nanostructure.
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