Invention Grant
- Patent Title: Implant delivery device
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Application No.: US16698561Application Date: 2019-11-27
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Publication No.: US11357513B2Publication Date: 2022-06-14
- Inventor: Heath Bowman , Jake Le , Matthew Fitz
- Applicant: MicroVention, Inc.
- Applicant Address: US CA Aliso Viejo
- Assignee: MicroVention, Inc.
- Current Assignee: MicroVention, Inc.
- Current Assignee Address: US CA Aliso Viejo
- Agency: Inskeep IP Group, Inc.
- Main IPC: A61B17/12
- IPC: A61B17/12 ; A61F2/95 ; A61M25/00 ; A61B17/00 ; A61B90/00 ; A61B17/42

Abstract:
A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
Public/Granted literature
- US20200093495A1 Implant Delivery Device Public/Granted day:2020-03-26
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