Invention Grant
- Patent Title: Multi-scale three-dimensional pentamode metamaterial and additive manufacturing method thereof
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Application No.: US17401334Application Date: 2021-08-13
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Publication No.: US11358223B2Publication Date: 2022-06-14
- Inventor: Bo Song , Junxiang Fan , Shuaishuai Wei , Yusheng Shi
- Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Applicant Address: CN Hubei
- Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: CN Hubei
- Agency: JCIPRNET
- Priority: CN202011111080.X 20201016
- Main IPC: B22F10/28
- IPC: B22F10/28 ; B33Y80/00 ; B33Y10/00 ; C22C14/00

Abstract:
The disclosure belongs to a technical field related to metamaterials and discloses a multi-scale three-dimensional pentamode metamaterial and an additive manufacturing method thereof. The multi-scale three-dimensional pentamode metamaterial has a body centered cubic (BCC) structure and includes a plurality of rods and a plurality of node structures. Two ends of each of the rods are connected to the node structures. Each of the rods has a cylindrical shape and is provided with a biconical through hole. From one end of the rod towards the other end of the rod, a diameter of the biconical through hole gradually decreases and then gradually increases. A chamber is formed inside each of the node structures, the biconical through hole communicates with the chamber, and the chamber is filled with a lattice structure.
Public/Granted literature
- US20220118518A1 MULTI-SCALE THREE-DIMENSIONAL PENTAMODE METAMATERIAL AND ADDITIVE MANUFACTURING METHOD THEREOF Public/Granted day:2022-04-21
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