The present invention is to provide an optical scanner module. An optical scanner apparatus scans laser light by oscillating a mirror with a piezoelectric element. A package that mounts the optical scanner apparatus and electrically is connected to a substrate via a connector. A package cover that is fixed to the package and seals the optical scanner apparatus so that the optical scanner apparatus is not visually recognized from an outside. The package and the package cover are bonded by a heat curing adhesive agent. A vent for releasing gas in a space where the optical scanner apparatus is sealed is formed in the package cover, and the vent is blocked by ultraviolet curing resin.