Invention Grant
- Patent Title: Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
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Application No.: US16978564Application Date: 2019-03-11
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Publication No.: US11365274B2Publication Date: 2022-06-21
- Inventor: Hiroaki Umehara , Yiqun Wang , Hiroharu Inoue
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-063240 20180328
- International Application: PCT/JP2019/009679 WO 20190311
- International Announcement: WO2019/188189 WO 20191003
- Main IPC: C08F290/06
- IPC: C08F290/06 ; C08J5/24 ; B32B15/08 ; H05K1/05

Abstract:
A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
Public/Granted literature
Information query
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