Invention Grant
- Patent Title: Electronic substrate and manufacture method thereof, and electronic device
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Application No.: US16475804Application Date: 2018-12-24
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Publication No.: US11366556B2Publication Date: 2022-06-21
- Inventor: Jun Chen , Ming Zhang , Qicheng Chen , Huan Liu
- Applicant: Hefei Xinsheng Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Anhui; CN Beijing
- Assignee: Hefei Xinsheng Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Hefei Xinsheng Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Anhui; CN Beijing
- Agency: Banner & Witcoff, Ltd.
- Priority: CN201810089650.6 20180130
- International Application: PCT/CN2018/123230 WO 20181224
- International Announcement: WO2019/148999 WO 20190808
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041 ; H05K1/02 ; H05K1/09 ; H05K3/46
Abstract:
An electronic substrate and a manufacture method thereof, and an electronic device are provided, the electronic substrate includes a base substrate and a first conductive structure on the base substrate, a portion of the first conductive structure on the base substrate and at least on a side of the first conductive structure away from the base substrate has an etching barrier property.
Public/Granted literature
- US20210405810A1 Electronic Substrate and Manufacture Method Thereof, and Electronic Device Public/Granted day:2021-12-30
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