Invention Grant
- Patent Title: Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the same
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Application No.: US16633368Application Date: 2018-07-24
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Publication No.: US11367665B2Publication Date: 2022-06-21
- Inventor: Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun Ro Yoon
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Agent Daniel J. Greenhalgh
- International Application: PCT/US2018/043460 WO 20180724
- International Announcement: WO2019/023213 WO 20190131
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/13 ; B32B17/06 ; B81B1/00 ; C03C3/087 ; C03C3/091 ; C03C3/093 ; C03C3/097 ; C03C15/00 ; H01L21/48 ; H01L23/15 ; H01L23/498 ; C03C23/00
Abstract:
The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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