Invention Grant
- Patent Title: High-density flip chip package for wireless transceivers
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Application No.: US16875972Application Date: 2020-05-15
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Publication No.: US11367697B2Publication Date: 2022-06-21
- Inventor: Ibrahim Ramez Chamas , Mohamed Abouzied , Bhushan Shanti Asuri
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/00 ; H01L23/58 ; H03H7/42 ; H04B1/40
Abstract:
An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.
Public/Granted literature
- US20210358871A1 HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS Public/Granted day:2021-11-18
Information query
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