Invention Grant
- Patent Title: Semiconductor device structure
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Application No.: US16853889Application Date: 2020-04-21
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Publication No.: US11367788B2Publication Date: 2022-06-21
- Inventor: Jing-Chyi Liao , Ching-Chung Ko , Zheng Zeng
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsinchu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device structure is provided. A first well region with a first type of conductivity is formed over a semiconductor substrate. A second well region with a second type of conductivity is formed over the semiconductor substrate. A well region is formed over the semiconductor substrate and between the first and second well regions. A first gate structure is disposed on the well region and partially over the first and second well regions. A drain region is in the first well region. A source region and a bulk region are in the second well region. The drain region, the source region and the bulk region have the first type of conductivity. A second gate structure is disposed on the second well region, and separated from the first gate structure by the source region and the bulk region.
Public/Granted literature
- US20200373428A1 SEMICONDUCTOR DEVICE STRUCTURE Public/Granted day:2020-11-26
Information query
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