Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having asymmetric source and drain contact structures
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Application No.: US16134817Application Date: 2018-09-18
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Publication No.: US11367796B2Publication Date: 2022-06-21
- Inventor: Biswajeet Guha , Mauro J. Kobrinsky , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/423 ; H01L27/088 ; H01L21/8234 ; H01L29/06

Abstract:
Gate-all-around integrated circuit structures having asymmetric source and drain contact structures, and methods of fabricating gate-all-around integrated circuit structures having asymmetric source and drain contact structures, are described. For example, an integrated circuit structure includes a vertical arrangement of nanowires above a fin. A gate stack is over the vertical arrangement of nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of nanowires. A second epitaxial source or drain structure is at a second end of the vertical arrangement of nanowires. A first conductive contact structure is coupled to the first epitaxial source or drain structure. A second conductive contact structure is coupled to the second epitaxial source or drain structure. The second conductive contact structure is deeper along the fin than the first conductive contact structure.
Public/Granted literature
- US20200091348A1 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN CONTACT STRUCTURES Public/Granted day:2020-03-19
Information query
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