Invention Grant
- Patent Title: Cover, method of producing cover, and secondary processing die used for producing cover
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Application No.: US17518893Application Date: 2021-11-04
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Publication No.: US11370582B2Publication Date: 2022-06-28
- Inventor: Tomoko Mita , Michihisa Yamazaki , Ryoichi Takita
- Applicant: TOPPAN INC.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN INC.
- Current Assignee: TOPPAN INC.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2019-092962 20190516
- Main IPC: B65D41/18
- IPC: B65D41/18 ; B29C33/44

Abstract:
A method of forming an undercut which is engageable with an edge, on a side wall of a cover intermediate body using a cover intermediate body and a secondary processing die. In the secondary processing die, a moving inner core has, on the outer surface thereof, a concave shape corresponding to a convex shape of the inner surface of the undercut. The moving inner core is made up of a plurality of core segments which are arranged along the circumferential direction. Each core segment is vertically movable along an inclined surface of a core. When the moving inner core is moved upward, the moving inner core transforms smaller than the inner diameter of the side wall of a cover. The slide core has, on the inner surface thereof, a convex shape corresponding to the concave shape of the undercut.
Public/Granted literature
- US11407565B2 Cover, method of producing cover, and secondary processing die used for producing cover Public/Granted day:2022-08-09
Information query
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