Invention Grant
- Patent Title: Array substrate and fabrication method thereof, array substrate motherboard and display device
-
Application No.: US16609842Application Date: 2019-04-26
-
Publication No.: US11374083B2Publication Date: 2022-06-28
- Inventor: Hongfei Cheng
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Dave Law Group LLC
- Agent Raj S. Dave
- Priority: CN201810602404.6 20180612
- International Application: PCT/CN2019/084619 WO 20190426
- International Announcement: WO2019/237841 WO 20191219
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L27/02

Abstract:
An array substrate and a fabrication method thereof, an array substrate motherboard, and a display device are disclosed. The array substrate includes a display region and a bonding region outside the display region. The array substrate further includes: a bonding electrode, located in the bonding region and spaced apart from an outer edge of the bonding region; and an electrostatic barrier line, the electrostatic barrier line has one end electrically connected with the bonding electrode, and the other end extends to the outer edge of the bonding region, and resistivity of the electrostatic barrier line is greater than resistivity of the bonding electrode.
Public/Granted literature
- US20210335978A1 ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, ARRAY SUBSTRATE MOTHERBOARD AND DISPLAY DEVICE Public/Granted day:2021-10-28
Information query
IPC分类: