- 专利标题: High voltage semiconductor device
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申请号: US17140140申请日: 2021-01-04
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公开(公告)号: US11374096B1公开(公告)日: 2022-06-28
- 发明人: Chung-Ren Lao , Kuan-I Ho , Kuo-Chien Hsu , Che-Hua Chang , Hsiao-Ying Yang , Chih-Cherng Liao
- 申请人: Vanguard International Semiconductor Corporation
- 申请人地址: TW Hsinchu
- 专利权人: Vanguard International Semiconductor Corporation
- 当前专利权人: Vanguard International Semiconductor Corporation
- 当前专利权人地址: TW Hsinchu
- 代理商 Winston Hsu
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/10 ; H01L29/40 ; H01L29/78
摘要:
The present disclosure provides a high voltage semiconductor device includes a substrate, a first well region, a second well region, a source, a drain, a first electrode structure and a second electrode structure. The first well region and the second well region are disposed in the substrate, and which includes a first conductive type and a second conductive type which are complementary with each other. The source and the drain are respectively disposed within the first well region and the second well region. The first electrode structure and the second electrode structure are both disposed on the substrate, and the distance between the top surface of an electrode of the first electrode structure and the top surface of the substrate includes a first height and a second height which are different from each other.
公开/授权文献
- US20220216308A1 High Voltage Semiconductor Device 公开/授权日:2022-07-07
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