An electronic device according to various embodiments of the present invention may comprise a housing; an inner plate which is built into the housing, at least a portion of which is made of a synthetic resin material, and which comprises a first surface, a second surface facing the opposite direction to the first surface, a first through-hole formed in a cone-shaped cross-section the diameter of which gradually decreases the closer to the second surface from the first surface, and a second through-hole formed in a cone-shaped cross-section, which is disposed adjacent to the first through-hole and the diameter of which gradually decreases the closer to the first surface from the second surface; a first conductive line which is formed on the first surface and is formed to overlap with the first through-hole at least partially when viewed from the first surface, a second conductive line which is formed on the second surface and is formed to overlap with the second through-hole at least partially when viewed from the second surface, a first conductive layer which is deposited conformally on an inner wall of the first through-hole and electrically connected to at least one of the first conductive line and the second conductive line, a second conductive layer which is deposited conformally on an inner wall of the second through-hole and electrically connected to at least one of the first conductive line and the first conductive line, and a wireless communication module which is electrically connected to at least one of the first conductive line and the second conductive line, wherein the first conductive line, the second conductive line, the first conductive layer, and the second conductive layer may comprise the same composition of materials. Such an electronic device may vary according to the embodiment.