- 专利标题： Patch antennas stitched to systems in packages and methods of assembling same
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申请号： US16473566申请日： 2017-03-31
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公开(公告)号： US11374323B2公开(公告)日： 2022-06-28
- 发明人: Andreas Augustin , Sonja Koller , Bernd Waidhas , Georg Seidemann , Andreas Wolter , Stephan Stoeckl , Thomas Wagner , Josef Hagn
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 国际申请： PCT/US2017/025512 WO 20170331
- 国际公布： WO2018/182718 WO 20181004
- 主分类号： H01Q9/04
- IPC分类号： H01Q9/04 ; H01L23/00 ; H01Q1/22 ; H01Q21/06
摘要：
A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.
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