- 专利标题: Manufacturing method for multiple MEMS sound transducers
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申请号: US16745959申请日: 2020-01-17
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公开(公告)号: US11375317B2公开(公告)日: 2022-06-28
- 发明人: Andrea Rusconi Clerici Beltrami , Ferruccio Bottoni , Nick Renaud-Bezot
- 申请人: USOUND GMBH
- 申请人地址: AT Graz
- 专利权人: USOUND GMBH
- 当前专利权人: USOUND GMBH
- 当前专利权人地址: AT Graz
- 代理机构: Dority & Manning, P.A.
- 优先权: DE102019101227.9 20190117,DE102019101325.9 20190118
- 主分类号: H04R17/00
- IPC分类号: H04R17/00 ; B81C1/00 ; H04R19/00 ; H04R31/00
摘要:
A manufacturing method for multiple MEMS sound transducers includes manufacturing a reconstructed wafer, separating multiple chips from the wafer, and encapsulating the chips in a molding material. A piezoelectric element of the particular chips is exposed to become deflectable along a stroke axis. The reconstructed wafer is connected to multiple diaphragms associated with the particular chips, wherein the diaphragms are each connected to the associated piezoelectric element so that the diaphragms are each deflectable together with the at least one associated piezoelectric element along the stroke axis. MEMS sound transducers, each of which including at least one of the chips and one of the diaphragms, are isolated. A MEMS sound transducer, which has been manufactured using the aforementioned manufacturing method, is also disclosed.
公开/授权文献
- US20200236467A1 MANUFACTURING METHOD FOR MULTIPLE MEMS SOUND TRANSDUCERS 公开/授权日:2020-07-23