Invention Grant
- Patent Title: Toughened adhesive and bonding method using the same
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Application No.: US16485071Application Date: 2018-12-18
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Publication No.: US11377530B2Publication Date: 2022-07-05
- Inventor: Leonard Macadams , Dalip K. Kohli
- Applicant: CYTEC INDUSTRIES INC.
- Applicant Address: US NJ Princeton
- Assignee: CYTEC INDUSTRIES INC.
- Current Assignee: CYTEC INDUSTRIES INC.
- Current Assignee Address: US NJ Princeton
- Agent Thi Dang
- International Application: PCT/US2018/066147 WO 20181218
- International Announcement: WO2019/126111 WO 20190627
- Main IPC: C09J7/30
- IPC: C09J7/30 ; C09J7/10 ; B32B27/38 ; C08J5/24 ; C09J7/25 ; B32B7/12 ; B32B15/01 ; C09J5/06 ; C08K5/315
Abstract:
A bonding method for joining two structural parts using a curable adhesive layer having a fibrous veil embedded therein. The fibrous veil carries a polymeric binder, which is in a solid phase at room temperature (20° C.-25° C.) and is capable of dissolving into the adhesive composition during curing thereof.
Public/Granted literature
- US20200308358A1 TOUGHENED ADHESIVE AND BONDING METHOD USING THE SAME Public/Granted day:2020-10-01
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