Invention Grant
- Patent Title: Hinge assemblies
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Application No.: US16980868Application Date: 2018-03-16
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Publication No.: US11379014B2Publication Date: 2022-07-05
- Inventor: Wei-Chung Chen , Kuan-Ting Wu
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Lakshmi Kumaran & Sridharan
- International Application: PCT/US2018/022931 WO 20180316
- International Announcement: WO2019/177622 WO 20190919
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/16 ; H05K5/02

Abstract:
Examples of hinge assemblies are described. In an example, a hinge assembly includes a first hinge element having a first shaft, a second hinge element having a second shaft, and a clip coupling the first shaft to the second shaft. The clip includes a first portion formed of c a composite material and a second portion formed of a metal.
Public/Granted literature
- US20210011526A1 HINGE ASSEMBLIES Public/Granted day:2021-01-14
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