A system of classifying a pattern of interest (POI) on a semiconductor specimen, where the system includes a processor and memory circuitry configured to obtain a high-resolution image of the POI, and generate data usable for classifying the POI in accordance with a defectiveness-related classification. Generating the data utilizes a machine learning model that has been trained in accordance with training samples. The training samples include a high-resolution training image captured by scanning a respective training pattern on a specimen, the respective training pattern being similar to the POI, and a label associated with the image. The label is derivative of low-resolution inspection of the respective training pattern.