Invention Grant
- Patent Title: Methods of forming electronic assemblies with textured surfaces using low current density electroplating
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Application No.: US16696120Application Date: 2019-11-26
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Publication No.: US11380604B2Publication Date: 2022-07-05
- Inventor: Shailesh N. Joshi , Paul Braun , Julia Kohanek , Gaurav Singhal
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
- Applicant Address: US TX Plano; US IL Champaign
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,The Board of Trustees of the University of Illinois
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,The Board of Trustees of the University of Illinois
- Current Assignee Address: US TX Plano; US IL Champaign
- Agency: Dinsmore & Shohl LLP
- Main IPC: H01L23/427
- IPC: H01L23/427 ; F28D15/02 ; H01L21/48

Abstract:
A method of forming a textured surface layer along a substrate that includes disposing a plurality of polymer spheres on a surface of the metal substrate, and electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate. The metal layer does not extend above a top surface of the plurality of polymer spheres. The method further includes removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.
Public/Granted literature
- US20210159146A1 METHODS OF FORMING ELECTRONIC ASSEMBLIES WITH TEXTURED SURFACES USING LOW CURRENT DENSITY ELECTROPLATING Public/Granted day:2021-05-27
Information query
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