A method of manufacturing a batch of component carriers is disclosed. The method includes providing a plurality of separate wafer structures, each comprising a plurality of electronic components, simultaneously laminating the wafer structures with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and singularizing a structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components, a part of the at least one electrically conductive layer structure and a part of the at least one electrically insulating layer structure.