Invention Grant
- Patent Title: Vibration diaphragm in MEMS microphone and MEMS microphone
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Application No.: US16329193Application Date: 2017-03-03
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Publication No.: US11381917B2Publication Date: 2022-07-05
- Inventor: Junkai Zhan , Mengjin Cai
- Applicant: Goertek Inc.
- Applicant Address: CN Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Shandong
- Agency: Patent Law Works LLP
- Priority: CN201610784827.5 20160831
- International Application: PCT/CN2017/075590 WO 20170303
- International Announcement: WO2018/040528 WO 20180308
- Main IPC: H04R7/00
- IPC: H04R7/00 ; H04R19/00 ; H04R7/16 ; H04R7/04

Abstract:
The present invention discloses a vibration diaphragm in an MEMS microphone, and an MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body and at least one pressure relief device defined by gaps in the vibration diaphragm body, wherein the gaps comprise at least two sections of circular arc-shaped gaps sequentially connected together. The two adjacent sections of circular arc-shaped gaps are in an S shape as a whole and centrosymmetrical with respect to a connected position thereof. The pressure relief device comprises at least two valve clacks formed by at least two sections of adjacent circular arc-shaped gaps and neck portions connected to the valve clacks and the vibration diaphragm body and of a constraint shape.
Public/Granted literature
- US20190230439A1 VIBRATION DIAPHRAGM IN MEMS MICROPHONE AND MEMS MICROPHONE Public/Granted day:2019-07-25
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