Invention Grant
- Patent Title: Electronic package, assemble substrate, and method for fabricating the assemble substrate
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Application No.: US16589663Application Date: 2019-10-01
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Publication No.: US11382214B2Publication Date: 2022-07-05
- Inventor: Lung-Yuan Wang , Wen-Liang Lien
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Hsuanyeh Law Group PC
- Priority: TW108129257 20190816
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11 ; H05K1/18 ; H01L23/31 ; H05K3/32 ; H05K1/02
Abstract:
A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.
Public/Granted literature
- US20210051800A1 ELECTRONIC PACKAGE, ASSEMBLE SUBSTRATE, AND METHOD FOR FABRICATING THE ASSEMBLE SUBSTRATE Public/Granted day:2021-02-18
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