- 专利标题: Method of forming and decorticating a void in a sacroiliac joint
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申请号: US17372185申请日: 2021-07-09
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公开(公告)号: US11382770B2公开(公告)日: 2022-07-12
- 发明人: Sean LaNeve , Charles Girsch , Chris Girsch , Dwayne Polzer
- 申请人: Pain TEQ, LLC
- 申请人地址: US FL Tampa
- 专利权人: Pain TEQ, LLC
- 当前专利权人: Pain TEQ, LLC
- 当前专利权人地址: US FL Tampa
- 代理机构: Hill Ward Henderson, P.A.
- 代理商 Stepben E. Kelly; Thomas J. Banks
- 主分类号: A61F2/46
- IPC分类号: A61F2/46 ; A61B17/16 ; A61B17/02 ; A61B17/84 ; A61B17/92 ; A61F2/30 ; A61B17/00 ; A61B17/90
摘要:
A method for forming and abrading an implant void in a sacroiliac joint (“SI Joint”) without the use of a rotary cutting instrument. The method incorporates a multimodal abrading device having abrading surfaces on opposing sides and an open tip comprising a cutting edge. The method includes the step of using the abrading head to cut bone tissue from the SI Joint at an insertion point while simultaneously using the abrading surfaces to decorticate the cortical bone at the insertion point.
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