Invention Grant
- Patent Title: Co-injection-molded multilayer structure
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Application No.: US16342425Application Date: 2017-10-17
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Publication No.: US11383497B2Publication Date: 2022-07-12
- Inventor: Edgard Chow , Gene Medlock , Wataru Hirose
- Applicant: KURARAY CO., LTD.
- Applicant Address: JP Kurashiki
- Assignee: KURARAY CO., LTD.
- Current Assignee: KURARAY CO., LTD.
- Current Assignee Address: JP Kurashiki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/037461 WO 20171017
- International Announcement: WO2018/074445 WO 20180426
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B1/02 ; B32B27/30 ; B32B27/32 ; B29C45/16 ; B65D65/40 ; B29K23/00 ; B29L31/00

Abstract:
There is provided a co-injection-molded multilayer structure having a barrier layer and outer layers laminated on both sides of the barrier layer, wherein the barrier layer is made of a resin composition comprising an ethylene-vinyl alcohol copolymer (A) and an alkali metal salt (B) of a higher fatty acid having a melting point of 250° C. or lower; a content of the alkali metal salt (B) in the barrier layer is 50 to 1500 ppm in terms of metal atoms; and the outer layers are made of a resin composition comprising an unmodified polypropylene (E) and a maleic anhydride-modified polypropylene (F) having a lower melt viscosity than that of the unmodified polypropylene (E). Although it has no adhesive layers, the co-injection-molded multilayer structure exhibits excellent adhesiveness between the barrier layer made of an EVOH resin composition and the outer layer made of a polypropylene resin composition.
Public/Granted literature
- US20200180279A1 CO-INJECTION-MOLDED MULTILAYER STRUCTURE Public/Granted day:2020-06-11
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