Invention Grant
- Patent Title: Migrating logical volumes from a thick provisioned layout to a thin provisioned layout
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Application No.: US17103061Application Date: 2020-11-24
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Publication No.: US11385947B2Publication Date: 2022-07-12
- Inventor: Nivin Lawrence , Sandesh K. Rao , Manikandan Veerachamy , Amit Chandra , Tushar Sinha , Manoj Kumar , David W. Duffey
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Baker Botts, LLP
- Main IPC: G06F12/10
- IPC: G06F12/10 ; G06F9/54

Abstract:
The present disclosure is directed to migrating logical volumes from a thick provisioned layout to a thin provisioned layout, and includes one or more processors and one or more computer-readable non-transitory storage media comprising instructions that, when executed by the one or more processors, cause one or more components of the system to perform operations comprising creating an abstraction layer on top of a logical volume in a storage device, the abstraction layer for accessing the logical volume, the logical volume one of a plurality of logical volumes in a volume group of the storage device; allocating a thin pool from remaining storage space in the volume group of the storage device; creating a snapshot of the logical volume; adding a thin virtual volume corresponding to the logical volume to the thin pool; and copying data from the snapshot to the thin virtual volume.
Public/Granted literature
- US20210173726A1 MIGRATING LOGICAL VOLUMES FROM A THICK PROVISIONED LAYOUT TO A THIN PROVISIONED LAYOUT Public/Granted day:2021-06-10
Information query