- 专利标题: Stacked DRAM memory device for improving integration density and reducing bit line capacitance
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申请号: US17150854申请日: 2021-01-15
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公开(公告)号: US11386950B2公开(公告)日: 2022-07-12
- 发明人: Kee Teok Park
- 申请人: SK hynix Inc.
- 申请人地址: KR Icheon-si Gyeonggi-do
- 专利权人: SK hynix Inc.
- 当前专利权人: SK hynix Inc.
- 当前专利权人地址: KR Icheon-si Gyeonggi-do
- 代理机构: William Park & Associates Ltd.
- 优先权: KR10-2020-0099974 20200810
- 主分类号: G11C7/12
- IPC分类号: G11C7/12 ; G11C11/4094 ; H01L27/108 ; G11C11/408 ; G11C11/4091
摘要:
A stacked memory device includes a plurality of lower word lines extending in a first direction, a bit line positioned over the plurality of the lower word lines and extending in a second direction intersecting with the first direction, and a plurality of upper word lines positioned over the bit line and extending in the first direction. The stacked memory device also includes a plurality of lower memory cells including a lower capacitor and a lower switching element between the lower word lines and the bit line. The stacked memory device further includes a plurality of upper memory cells including an upper capacitor and an upper switching element between the bit line and the upper word lines.
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