- Patent Title: LED transferring method and display module manufactured by the same
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Application No.: US16850645Application Date: 2020-04-16
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Publication No.: US11387384B2Publication Date: 2022-07-12
- Inventor: Sangmoo Park , Minsub Oh , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Dongyeob Lee , Yoonsuk Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0044548 20190416,KR10-2019-0132193 20191023
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/24 ; H01L25/075

Abstract:
A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.
Public/Granted literature
- US20200335659A1 LED TRANSFERRING METHOD AND DISPLAY MODULE MANUFACTURED BY THE SAME Public/Granted day:2020-10-22
Information query
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