- 专利标题： Photosensitive component, and camera module and manufacturing method therefor
-
申请号： US16322946申请日： 2017-06-02
-
公开(公告)号： US11388320B2公开(公告)日： 2022-07-12
- 发明人: Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
- 申请人： NINGBO SUNNY OPOTECH CO., LTD.
- 申请人地址： CN Zhejiang
- 专利权人： NINGBO SUNNY OPOTECH CO., LTD.
- 当前专利权人： NINGBO SUNNY OPOTECH CO., LTD.
- 当前专利权人地址： CN Zhejiang
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： CN201610516600.2 20160703,CN201620691699.5 20160703,CN201611067131.7 20161128,CN201621286847.1 20161128,CN201710065909.9 20170206,CN201720112605.9 20170206
- 国际申请： PCT/CN2017/086998 WO 20170602
- 国际公布： WO2018/006673 WO 20180111
- 主分类号： H04N5/225
- IPC分类号： H04N5/225 ; H05K1/02
摘要：
A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
公开/授权文献
信息查询
