Invention Grant
- Patent Title: Speaker module
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Application No.: US17294516Application Date: 2018-12-27
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Publication No.: US11388522B2Publication Date: 2022-07-12
- Inventor: Chengwei Li , Meng Chen , Zhenjun Li
- Applicant: Goertek Inc.
- Applicant Address: CN Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Shandong
- Agency: Baker Botts, LLP
- Priority: CN201811368266.6 20181116
- International Application: PCT/CN2018/124432 WO 20181227
- International Announcement: WO2020/098101 WO 20200522
- Main IPC: H04R9/06
- IPC: H04R9/06 ; H04R9/02 ; H04R1/10 ; H04R1/02

Abstract:
A speaker module comprising a module middle housing and a static electricity removal structure; the static electricity removal structure comprises a conductive plastic member, a metal insert connected to the conductive plastic member, a conductive steel sheet and a fixing component; the module middle housing is provided with a protruding part on an outer lateral wall thereof; the metal insert and the fixing component are injection molded on the protruding part; the conductive steel sheet is connected to the metal insert with one end thereof and is connected to a first portion of an external device with the other end thereof; the conductive plastic member is fixed onto the protruding part by a secondary injection molding; the metal insert is conductively connected to the fixing component by the conductive plastic member; the speaker module is disposed at a second portion of the external device of the fixing component.
Public/Granted literature
- US20220030359A1 SPEAKER MODULE Public/Granted day:2022-01-27
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