Invention Grant
- Patent Title: Vinyl substrate printing
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Application No.: US16603567Application Date: 2018-06-25
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Publication No.: US11407235B2Publication Date: 2022-08-09
- Inventor: Josep Maria Cuner Utges , Aleix Fort Filgueira , Alejandro Mielgo Barba
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2018/039341 WO 20180625
- International Announcement: WO2020/005201 WO 20200102
- Main IPC: B41J11/00
- IPC: B41J11/00 ; B41M1/30 ; B41J29/377 ; B41M5/00

Abstract:
The present disclosure relates to vinyl substrate printing. In an example, a vinyl printing apparatus is disclosed wherein the apparatus comprises a media path to convey a vinyl substrate along a feed direction from a substrate supply to a print zone; an inkjet printhead to print on the print substrate at the print zone; and a heater upstream of the print zone to heat the print substrate to evaporate a plasticizer from a surface of the print substrate.
Public/Granted literature
- US20210331492A1 VINYL SUBSTRATE PRINTING Public/Granted day:2021-10-28
Information query
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