Invention Grant
- Patent Title: Deposition of tellurium-containing thin films
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Application No.: US17163687Application Date: 2021-02-01
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Publication No.: US11408068B2Publication Date: 2022-08-09
- Inventor: Thomas Knisley , Keenan N. Woods , Mark Saly , Charles H. Winter , Apoorva Upadhyay
- Applicant: Applied Materials, Inc. , Wayne State University
- Applicant Address: US CA Santa Clara; US MI Detroit
- Assignee: Applied Materials, Inc.,Wayne State University
- Current Assignee: Applied Materials, Inc.,Wayne State University
- Current Assignee Address: US CA Santa Clara; US MI Detroit
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/18
- IPC: C23C16/18 ; C23C16/455 ; C23C16/30 ; C23C16/44 ; H01L21/02 ; H01L21/285
Abstract:
Methods for depositing tellurium-containing films on a substrate are described. The substrate is exposed to a tellurium precursor and a reactant to form the tellurium-containing film (e.g., elemental tellurium, tellurium oxide, tellurium carbide, tellurium silicide, germanium telluride, antimony telluride, germanium antimony telluride). The exposures can be sequential or simultaneous.
Public/Granted literature
- US20210262084A1 DEPOSITION OF TELLURIUM-CONTAINING THIN FILMS Public/Granted day:2021-08-26
Information query
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