An imprint apparatus performs an imprint process of forming a pattern on a substrate by bringing a mold into contact with an imprint material on the substrate and curing the imprint material. The apparatus includes a substrate stage mechanism having a substrate chuck configured to hold the substrate, a mold driver configured to drive the mold, and a controller configured to control, based on tilt information indicating a tilt of the substrate chuck which is caused by a force received from the mold driver, the mold driver so as to adjust a relative tilt of the mold with respect to the substrate in the imprint process.