An apparatus and method for embossing a substrate are disclosed. For example, the apparatus includes an embossing platform, a printhead to dispense ink on the embossing platform in a desired raised pattern on the embossing platform, a press to apply a load against a substrate placed on the desired raised pattern and the embossing platform to emboss the desired raised pattern onto the substrate, and an ink removal device to remove the ink that is dispensed on the embossing platform in the desired raised pattern.