- 专利标题: Electronic device having supporting resin and manufacturing method thereof
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申请号: US16704961申请日: 2019-12-05
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公开(公告)号: US11417624B2公开(公告)日: 2022-08-16
- 发明人: Hideaki Yanagida
- 申请人: ROHM CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: ROHM CO., LTD.
- 当前专利权人: ROHM CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Hamre, Schumann, Mueller & Larson, P.C.
- 优先权: JPJP2019-032444 20190226
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L23/31 ; H01L21/56
摘要:
An electronic device includes: a first resin layer having a first resin layer main surface and a first resin layer inner surface; a columnar conductor having a columnar conductor main surface and a columnar conductor inner surface and penetrating the first resin layer in direction z; a wiring layer connecting the first resin layer main surface and the first conductor main surface; an electronic component being electrically connected and joined to the wiring layer; a second resin layer having a second resin layer main surface facing the same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface, covering the wiring layer and the electronic component; and an external electrode closer to the side where the first resin layer inner surface faces than the first resin layer and is electrically connected to the columnar conductor.
公开/授权文献
- US20200273834A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2020-08-27
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