- Patent Title: Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same
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Application No.: US17061345Application Date: 2020-10-01
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Publication No.: US11421073B2Publication Date: 2022-08-23
- Inventor: Jonghoon Won , In Kim , Kyeong Pang , Mooho Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cantor Colburn LLP
- Priority: KR10-2019-0145923 20191114
- Main IPC: C08G59/24
- IPC: C08G59/24 ; C08K3/013 ; C09K19/38 ; C09K19/32 ; C08G59/62 ; H01L21/56

Abstract:
A highly thermally conductive epoxy compound, and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package, each including the highly thermally conductive epoxy compound. The epoxy compound is represented by Chemical Formula 1 below and has at least one mesogenic naphthalene unit. E1-M1-L1-M2-L2-M3-E2 Chemical Formula 1 In Chemical Formula 1, at least one of M1, M2, or M3, which are mesogenic units, is a naphthalene unit. M1, M2, M3, L1, L2, and E1 and E2 are as defined in the detailed description.
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