Invention Grant
- Patent Title: Layer 3 multi-chassis link aggregation group
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Application No.: US16368192Application Date: 2019-03-28
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Publication No.: US11425031B2Publication Date: 2022-08-23
- Inventor: Tathagata Nandy , Venkatavaradhan Devarajan , Mithun Kumar Halder
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H04L45/24
- IPC: H04L45/24 ; H04L69/14 ; H04L69/325 ; H04L61/5007 ; H04L45/74 ; H04L61/103 ; H04L45/58 ; H04L12/46

Abstract:
Examples disclosed herein relate to establishing a layer 3 (L3) Multi-Chassis Link Aggregation Group (MC-LAG). In an example, a common IP address and a common MAC address may be associated with a primary network device and a secondary network device. A layer 3 MC-LAG may be established in a multi-homing configuration between the primary network device and the secondary network device to provide a redundant L3 connectivity to a core network device in a network. A dedicated communication link may be established between the primary network device and the secondary network device, for the primary network device and the secondary network device to share network packets.
Public/Granted literature
- US20200314003A1 LAYER 3 MULTI-CHASSIS LINK AGGREGATION GROUP Public/Granted day:2020-10-01
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