Invention Grant
- Patent Title: Flexible circuit card assembly with preformed undulations for surveillance system hinge assembly
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Application No.: US17248666Application Date: 2021-02-02
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Publication No.: US11425814B2Publication Date: 2022-08-23
- Inventor: Kirantu Madhava , Nouduri Phani Srinivas , Ramesh Achutha Rao
- Applicant: Rosemount Aerospace Inc.
- Applicant Address: US MN Burnsville
- Assignee: Rosemount Aerospace Inc.
- Current Assignee: Rosemount Aerospace Inc.
- Current Assignee Address: US MN Burnsville
- Agency: Kinney & Lange, P.A.
- Priority: IN202041017304 20200422
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B64D45/00 ; B64D43/00 ; H05K1/11
Abstract:
A hinge assembly configured for attachment to two objects is described herein. The hinge assembly includes: a flexible circuit board having planar conductive circuitry and including at least one preformed undulation in a region of the flexible circuit board, wherein the at least one undulation is configured to allow the flexible circuit board to bend at the region; and a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to allow attachment of the flexible circuit board to the two objects, wherein the flexible circuit board is configured to movably and electrically connect the two objects.
Public/Granted literature
- US20210337655A1 FLEXIBLE CIRCUIT CARD ASSEMBLY WITH PREFORMED UNDULATIONS FOR SURVEILLANCE SYSTEM HINGE ASSEMBLY Public/Granted day:2021-10-28
Information query
